Description

TC160-NF 160×120 narrow-FOV LWIR thermal imaging module

Compact 160×120 uncooled LWIR module for embedded thermal sensing and OEM integration.

TC160-NF is a compact uncooled LWIR thermal imaging module for engineering teams building embedded thermal sensing products, smart devices, HVAC monitoring, compact security sensing, and low-power OEM thermal systems. It is planned around SPI host integration, 3.3 V supply, narrow-FOV optics, and factory-calibrated thermal output.

160 x 120Resolution

8-14 umLWIR band

25 FPSMax frame rate

SPIHost interface

3.3 VPower supply

56 / 45 / 34 degFOV D/H/V

Buyer Summary

Where this 160×120 LWIR thermal module fits

TC160-NF is a module-level thermal imaging core, not a complete handheld camera. It is suited for OEM teams, embedded-system developers, smart-appliance designers, HVAC monitoring projects, and compact sensing products that need a small thermal input path before enclosure and host-board design are finalized.

Use it when your project needs low power, compact size, SPI integration, and a narrower field of view for more concentrated scene coverage. Confirm final lens details, mechanical drawing, documentation package, quantity, and availability during RFQ.

Key Specifications

Technical parameters for OEM evaluation

Detector
Product model	TC160-NF
SKU reference	MI1602M5S
Detector class	Uncooled LWIR thermal imaging module
Resolution	160 x 120
Total pixels	19,200 reference
Detector pitch	35 um reference
Spectral range	8-14 um
Frame rate	Up to 25 FPS
Optics
Field of view	56 / 45 / 34 deg in D/H/V order
Optical path	Narrow-FOV fixed optical configuration
Lens details	Confirm final lens material and mechanical drawing during RFQ
Power and Interface
Supply voltage	3.3 V
Power consumption	Low-power operation, around 76-78 mW reference
Host interface	SPI
Connector path	10-pin FPC, 0.5 mm pitch reference; confirm host connector during RFQ
Environmental and Integration
Operating temperature	-20 deg C to +85 deg C reference
Calibration	Factory calibrated thermal output
USB evaluation path	Available through evaluation-board planning; confirm during RFQ

Application Fit

Application scenarios for embedded thermal sensing

Smart appliance sensingFor compact thermal input in appliances and devices that need low-power temperature awareness.

HVAC and room monitoringFor thermal presence, heat distribution, and room-condition monitoring where 160×120 resolution is sufficient.

Embedded security sensingFor compact monitoring devices where narrow-FOV thermal detection supports scene awareness.

IoT and edge AI inputFor host boards that need a small LWIR data source for sensing, classification, or event detection workflows.

Integration Notes

FPC/SPI host-board integration path

TC160-NF compact SPI thermal imaging module with FPC host-board integration concept — TC160-NF is intended for embedded host-board planning. Confirm FPC orientation, SPI timing, host connector, processor path, and documentation needs during RFQ.

Specification Snapshot

Core parameters for first-pass product review

TC160-NF 160x120 LWIR thermal imaging module specification summary — Specification summary for early OEM review. Final lens, mechanical drawing, documentation package, quantity, and availability should be confirmed during RFQ.

RFQ Checklist

Information to provide before requesting a quote

Target application: smart appliance, HVAC monitoring, embedded security sensing, IoT device, or another OEM system.
Estimated prototype and annual quantity.
Bare module, evaluation-board path, or host-board integration support requirement.
FOV, working distance, enclosure limits, and host MCU or processor platform.
Interface needs such as SPI, USB evaluation, GUI software, SDK, or documentation package.
Destination market and required procurement documents.

Product FAQ

FAQ for OEM buyers

Is TC160-NF a complete thermal camera?

No. TC160-NF is positioned as a compact LWIR thermal imaging module for OEM and embedded-system integration. Host electronics, enclosure, interface planning, and documentation should be reviewed during RFQ.

What interface does TC160-NF use?

The bare module path is planned around SPI host integration through an FPC connector. If USB evaluation, GUI software, or processor-board support is needed, request that path during RFQ.

What does narrow-FOV mean for this module?

The 56 / 45 / 34 deg D/H/V field-of-view reference provides more concentrated scene coverage than a wide-FOV module. Confirm working distance and target size before ordering.

What should be confirmed before ordering?

Confirm lens details, mechanical drawing, FPC orientation, host connector, interface documentation, quantity, availability, and any required compliance or procurement documents.

Next Steps

Compare, review documents, and request engineering support

View thermal imaging cores Thermal modules category Industrial thermal inspection applications Support and downloads Request RFQ

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TC160-NF 160×120 Uncooled LWIR Thermal Imaging Module