Download Center
HR21 thermal camera lens FOV documents for OEM integration.
Download the current HR21 thermal camera lens FOV datasheet, prepare an RFQ checklist, and request configuration-specific files for mechanical, electrical, interface, or compliance review.
HR21 document library
Public lens/FOV downloads, available references, and request-only materials.
Restricted documents are handled through RFQ so the file package matches the selected thermal camera lens, FOV, interface board, firmware, output configuration, and destination market.
| Document | Type | Access | Action |
|---|---|---|---|
| HR21 datasheet Specifications, thermal camera lens/FOV table, interface notes, power, mechanical data, and RFQ guidance. |
Public download | Download | |
| HR21 RFQ checklist Buyer input checklist for application, target distance, thermal camera lens/FOV, interface, documents, compliance, and commercial details. |
Public download | Download | |
| Mechanical dimension reference Current media-library drawing reference for enclosure and module dimension review. |
Image reference | Available reference | Open |
| Electrical interface diagram Available electrical interface image showing connector and integration reference points. |
Image reference | Available reference | Open |
| NDAA statement Supplier self-declaration for procurement review. NDAA statement available on request. |
Statement | Request by RFQ | Request |
| CVBS / interface configuration note USB, RS-422, TTL, BT656, LVDS / CameraLink, MIPI, SDI, and CVBS confirmation notes. |
Integration note | Request by RFQ | Request |
Thermal camera lens / FOV selection is included in the HR21 datasheet.
The current HR21 thermal camera lens FOV datasheet includes focal length options from 4.6 mm to 50 mm with corresponding IFOV values from the supplied product source material.
Open datasheetRestricted files should match the final configuration.
Detailed protocol, SDK, CAD source files, board configuration source documents, and NDAA statements should be issued after project context and configuration review.
Request document packetFuture development plan
Materials still missing and recommended next steps.
Create PDF plus DWG/DXF package from original mechanical source files, then gate CAD files behind RFQ.
Develop separate USB, RS-422, CVBS, BT656/LVDS, MIPI, and SDI notes with configuration-safe wording.
Convert the board configuration source into a clean PDF table and link it from both product page and Download Center.
Decide whether command protocol and SDK files are public, gated by RFQ, or shared only after NDA / project approval.